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Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution

Choudhury, Soud Farhan; Ladani, Leila

期刊名称Journal of Electronic Materials
作者Choudhury, Soud Farhan; Ladani, Leila
卷第45卷
期第7期
印刷ISSN0361-5235
电子ISSN1543-186X
文件大小2160.04KB
发表时间2016-7
DOI10.1007/s11664-016-4541-2
页码3683-3694

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