Molecular dynamics simulation overcoming the finite size effects of thermal conductivity of bulk silicon and silicon nanowires

• 期刊名称Modelling and Simulation in Materials Science and Engineering
• 作者Hou, Chaofeng; Xu, Ji; Ge, Wei; Li, Jinghai
• 卷第24卷
• 期第4期
• 印刷ISSN0965-0393
• 电子ISSN1361-651X
• 文件大小681.74KB
• 发表时间2016-05-01
• DOI10.1088/0965-0393/24/4/045005