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Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

Yang, Li; Ge, Jinguo; Zhang, Yaocheng; Dai, Jun; Liu, Haixiang; Xiang, Jicen
  • 期刊名称Journal of Electronic Materials
  • 作者Yang, Li; Ge, Jinguo; Zhang, Yaocheng; Dai, Jun; Liu, Haixiang; Xiang, Jicen
  • 卷第45卷
  • 期第7期
  • 印刷ISSN0361-5235
  • 电子ISSN1543-186X
  • 文件大小3968.10KB
  • 发表时间2016-7
  • DOI10.1007/s11664-016-4509-2
  • 页码3766-3775
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