Reliability aspects of copper metallization and interconnect technology for power devices
- 期刊名称Microelectronics Reliability
- 作者Hille, Frank; Roth, Roman; Schäffer, Carsten; Schulze, Holger; Heuck, Nicolas; Bolowski, Daniel; Guth, Karsten; Ciliox, Alexander; Rott, Karina; Umbach, Frank; Kerber, Martin
- 印刷ISSN0026-2714
- 文件大小3228.18KB
- 发表时间2016-9
- DOI10.1016/j.microrel.2016.07.119
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