[IEEE 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Shenzhen, China (2016.5.17-2016.5.21)] 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - New surface treatment method for copper foils to improve signal integrity of printed circuit board
Chia-Ling Chen, ; Fu-Je Chen, ; Meng-Hsien Chen, ; Ming-Kai Teng, ; James Chen, ; Shi-Ching Lin,
- 作者Chia-Ling Chen, ; Fu-Je Chen, ; Meng-Hsien Chen, ; Ming-Kai Teng, ; James Chen, ; Shi-Ching Lin,
- 文件大小1166.80KB
- 发表时间2016
- DOI10.1109/apemc.2016.7522804
- 页码584-586