[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Multi design variable optimization of QFN package on thick boards for enhanced board level reliability
Krishnamurthy, Sumanth; Deshpande, Abhishek; Md Malekkul Islam, ; Agonafer, Dereje
- 作者Krishnamurthy, Sumanth; Deshpande, Abhishek; Md Malekkul Islam, ; Agonafer, Dereje
- 文件大小536.50KB
- 发表时间2016
- DOI10.1109/ITHERM.2016.7517732
- 页码1546-1550