[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Design and evaluation of polymer-carbon nanotube composites for reliable, low resistance, static and dynamic thermal interface materials
- 作者Green, Craig E.; Prinzi, Leonardo; Cola, Baratunde A.
- 文件大小488.41KB
- 发表时间2016
- DOI10.1109/ITHERM.2016.7517611
- 页码657-661
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Back2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Title page2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Front cover2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Paper reviewers2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Organizing committee2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Copyright page2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Table of contents2016
[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Highly integrated thermoelectric coolersBarletta, Phil; Vick, Erik; Baldasaro, Nick; Temple, Dorota · 2016