Effects of crack and ITZ and aggregate on carbonation penetration based on 3D micro X-ray CT microstructure evolution
- 期刊名称Construction and Building Materials
- 作者Han, Jiande; Liu, Weiqing; Wang, Shuguang; Du, Dongsheng; Xu, Feng; Li, Weiwei; De Schutter, Geert
- 卷第128卷
- 印刷ISSN0950-0618
- 文件大小9603.45KB
- 发表时间2016-12
- DOI10.1016/j.conbuildmat.2016.10.062
- 页码256-271
[IEEE IEEE Holm Conference on Electrical Contracts - Chicago, IL, USA (17-19 Oct. 1994)] Proceedings of IEEE Holm Conference on Electrical Contracts - Estimation of the properties of contact materials used in vacuum interrupters based on investigations of microdischarge phenomenaMoscicka-Grzesiak, H.; Siodla, K.; Ziomek, W. · 1994
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Development of modular productsKusiak, A.; Chun-Che Huang, · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1996
Dynamic manufacturing process controlPearsall, K.; Raines, B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
Electronic Components ObsolescenceCondra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Nonvolatile MemoryBrewer, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Semiconductor workbench for integrated modelingWeckman, J. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
The benefits of stress testingChan, H.A. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1995
[Back cover]IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998
Call for papersIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1998