[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al joints in assembling LED lighting components

• 作者Chen, Guo-Liang; Zhou, Min-Bo; Zhang, Lang; Lin, Yuan-Jiang; Zhang, Yu-Peng; Zhang, Xin-Ping
• 文件大小1469.93KB
• 发表时间2016
• DOI10.1109/icept.2016.7583287
• 页码958-962