Reliability of Ag Sintering for Power Semiconductor Die Attach in High Temperature Applications
- 期刊名称IEEE Transactions on Power Electronics
- 作者Yu, Fang; Cui, Jinzi; Zhou, Zhangming; Fang, Kun; Johnson, R. Wayne; Hamilton, Michael C.
- 印刷ISSN0885-8993
- 电子ISSN1941-0107
- 文件大小7664.17KB
- 发表时间2016
- DOI10.1109/tpel.2016.2631128
- 页码1-1
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[IEEE ISAF '96. Tenth IEEE International Symposium on Applications of Ferroelectrics - East Brunswick, NJ, USA (18-21 Aug. 1996)] ISAF '96. Proceedings of the Tenth IEEE International Symposium on Applications of Ferroelectrics - Grain oriented technology of ferroelectric ceramicsOkazaki, K. · 1996