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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 10µm pitch Cu-Cu bonding interconnection for wafer level 3D integration

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 10µm pitch Cu-Cu bonding interconnection for wafer level 3D integration

Song, Chongshen; Li, Hengfu; Feng, Guangjian; Cao, Liqiang; Zhang, Wenqi

作者Song, Chongshen; Li, Hengfu; Feng, Guangjian; Cao, Liqiang; Zhang, Wenqi
文件大小1509.23KB
发表时间2016
DOI10.1109/icept.2016.7583291
页码979-982

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