[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - Toward predictive modeling of full-size packages with layered-medium integral-equation methods
Liu, C.; Menshov, A.; Subramanian, V.; Aygun, K.; Braunisch, H.; Okhmatovski, V. I.; Yilmaz, A. E.
- 作者Liu, C.; Menshov, A.; Subramanian, V.; Aygun, K.; Braunisch, H.; Okhmatovski, V. I.; Yilmaz, A. E.
- 文件大小812.62KB
- 发表时间2016
- DOI10.1109/EPEPS.2016.7835446
- 页码183-186