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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Mechanical in-situ characterization of micro systems during encapsulation and integration processes in structural components

Rost, Florian; Arnold, Benjamin; Vogel, Dietmar; Michel, Bernd; Rzepka, Sven
  • 作者Rost, Florian; Arnold, Benjamin; Vogel, Dietmar; Michel, Bernd; Rzepka, Sven
  • 文件大小19137.03KB
  • 发表时间2016
  • DOI10.1109/ESTC.2016.7764507
  • 页码1-5
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