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[IEEE 2016 3rd International Conference on Soft Computing & Machine Intelligence (ISCMI) - Dubai, United Arab Emirates (2016.11.23-2016.11.25)] 2016 3rd International Conference on Soft Computing & Machine Intelligence (ISCMI) - Parametric Analysis, Modeling and Optimization of Surface Roughness during EDAG Using CBN Abrasive

[IEEE 2016 3rd International Conference on Soft Computing & Machine Intelligence (ISCMI) - Dubai, United Arab Emirates (2016.11.23-2016.11.25)] 2016 3rd International Conference on Soft Computing & Machine Intelligence (ISCMI) - Parametric Analysis, Modeling and Optimization of Surface Roughness during EDAG Using CBN Abrasive

Shrivastava, Pankaj Kumar; Dubey, Avanish Kumar
  • 作者Shrivastava, Pankaj Kumar; Dubey, Avanish Kumar
  • 文件大小237.58KB
  • 发表时间2016
  • DOI10.1109/ISCMI.2016.28
  • 页码1-4
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