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Modeling of Cut Depth and Surface Analyses of Silicon Wafer in Laser Micromachining Process

Modeling of Cut Depth and Surface Analyses of Silicon Wafer in Laser Micromachining Process

Mekloy, Seksit; Tangwarodomnukun, Viboon; Dumkum, Chaiya
  • 期刊名称Applied Mechanics and Materials
  • 作者Mekloy, Seksit; Tangwarodomnukun, Viboon; Dumkum, Chaiya
  • 卷第835卷
  • 电子ISSN1662-7482
  • 文件大小421.36KB
  • 发表时间2016-5
  • DOI10.4028/www.scientific.net/amm.835.242
  • 页码242-247
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