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Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

Rajaguru, P.; Lu, H.; Bailey, C.; Ortiz-Gonzalez, J.; Alatise, O.

期刊名称Microelectronics Reliability
作者Rajaguru, P.; Lu, H.; Bailey, C.; Ortiz-Gonzalez, J.; Alatise, O.
卷第68卷
印刷ISSN0026-2714
文件大小1036.18KB
发表时间2017-01
DOI10.1016/j.microrel.2016.12.002
页码77-85

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