Through the Looking Glass -- The 2017 Edition: Trends in Solid-State Circuits from ISSCC

• 期刊名称IEEE Solid-State Circuits Magazine
• 作者Daly, Denis C.; Fujino, Laura C.; Smith, Kenneth C.
• 卷第9卷
• 期第1期
• 印刷ISSN1943-0582
• 文件大小5097.77KB
• 发表时间2017-24
• DOI10.1109/MSSC.2016.2622960
• 页码12-22