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Investigate the influence of bonding temperature in transient liquid phase bonding of SiC and copper

Investigate the influence of bonding temperature in transient liquid phase bonding of SiC and copper

Hynes, N. Rajesh Jesudoss; Velu, P. Shenbaga; Kumar, R.; Raja, M. Karthick

期刊名称Ceramics International
作者Hynes, N. Rajesh Jesudoss; Velu, P. Shenbaga; Kumar, R.; Raja, M. Karthick
卷第43卷
期第10期
印刷ISSN0272-8842
文件大小1187.83KB
发表时间2017-07
DOI10.1016/j.ceramint.2017.03.084
页码7762-7767

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