Thermal decomposition and kinetics of residual rubber seed cake and shell
- 期刊名称Journal of Thermal Analysis and Calorimetry
- 作者Reshad, Ali Shemsedin; Tiwari, Pankaj; Goud, Vaibhav V.
- 卷第129卷
- 期第1期
- 印刷ISSN1388-6150
- 电子ISSN1588-2926
- 文件大小1811.06KB
- 发表时间2017-7-20
- DOI10.1007/s10973-017-6136-4
- 页码577-592
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