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Characterization of critical conditions for fracture during wafer testing by FEM and experiments

Characterization of critical conditions for fracture during wafer testing by FEM and experiments

Ochoa Brezmes, Angel; Reuther, Georg; Gneupel, Andreas; Breitkopf, Cornelia
  • 期刊名称Materials Science in Semiconductor Processing
  • 作者Ochoa Brezmes, Angel; Reuther, Georg; Gneupel, Andreas; Breitkopf, Cornelia
  • 卷第67卷
  • 印刷ISSN1369-8001
  • 文件大小3042.67KB
  • 发表时间2017-08
  • DOI10.1016/j.mssp.2017.05.020
  • 页码124-140
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