Recent Developments on Epoxy Based Thermally Conductive Adhesives (TCA): A Review

• 期刊名称Polymer-Plastics Technology and Engineering
• 作者Singh, Amit Kumar; Panda, Bishnu Prasad; Mohanty, Smita; Nayak, Sanjay Kumar; Gupta, Manoj Kumar
• 印刷ISSN0360-2559
• 电子ISSN1525-6111
• 文件大小2757.19KB
• 发表时间2017-07-20
• DOI10.1080/03602559.2017.1354253