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The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics

The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics

Athichalinthorn, Panaaek; Darayen, Jidsucha; Puttichaem, Wachira; Techapiesancharoenkij, Ratchatee; Lohwongwatana, Boonrat
  • 期刊名称Key Engineering Materials
  • 作者Athichalinthorn, Panaaek; Darayen, Jidsucha; Puttichaem, Wachira; Techapiesancharoenkij, Ratchatee; Lohwongwatana, Boonrat
  • 卷第751卷
  • 电子ISSN1662-9795
  • 文件大小4274.03KB
  • 发表时间2017-8
  • DOI10.4028/www.scientific.net/kem.751.3
  • 页码3-8
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