Effect of bonding parameters on microstructural characteristics during TLP bonding of directionally solidified Ni-based superalloy
- 期刊名称Journal of Manufacturing Processes
- 作者Kim, Jeong Kil; Park, Hae Ji; Shim, Deog Nam; Kim, Dong Jin
- 卷第30卷
- 印刷ISSN1526-6125
- 文件大小7440.97KB
- 发表时间2017-12
- DOI10.1016/j.jmapro.2017.09.024
- 页码208-216
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