Sequence Impedance Modeling of Modular Multilevel Converters
- 期刊名称IEEE Journal of Emerging and Selected Topics in Power Electronics
- 作者Sun, Jian; Liu, Hanchao
- 印刷ISSN2168-6777
- 电子ISSN2168-6785
- 文件大小719.61KB
- 发表时间2017
- DOI10.1109/JESTPE.2017.2762408
- 页码1-1
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