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[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Mesh conforming electro-thermal co-analysis with application to PCB power integrity

[IEEE 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Washington, DC, USA (2017.8.7-2017.8.11)] 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) - Mesh conforming electro-thermal co-analysis with application to PCB power integrity

Sercu, Jeannick; Barnes, Heidi
  • 作者Sercu, Jeannick; Barnes, Heidi
  • 文件大小409.13KB
  • 发表时间2017
  • DOI10.1109/ISEMC.2017.8077936
  • 页码585-590
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