High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Lu, Qijun; Zhu, Zhangming; Yang, Yintang; Ding, Ruixue; Li, Yuejin
- 卷第7卷
- 期第12期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小1767.74KB
- 发表时间2017-12
- DOI10.1109/TCPMT.2017.2741340
- 页码2036-2044
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