[IEEE 2017 29th International Conference on Microelectronics (ICM) - Beirut, Lebanon (2017.12.10-2017.12.13)] 2017 29th International Conference on Microelectronics (ICM) - Investigating the effect of the density of phase change materials on cooling electronic packages
Farhat, Hussein; Mjallal, Ibrahim; Hammoud, Mohammad; Ali, Samer; Al Shaer, Ali; Assi, Ali; Assi, Ibrahim
- 作者Farhat, Hussein; Mjallal, Ibrahim; Hammoud, Mohammad; Ali, Samer; Al Shaer, Ali; Assi, Ali; Assi, Ibrahim
- 文件大小723.92KB
- 发表时间2017
- DOI10.1109/ICM.2017.8268831
- 页码1-5