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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Investigation on the ESD failure mechanism of integrated circuits in a 0.11µm CMOS process

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Investigation on the ESD failure mechanism of integrated circuits in a 0.11µm CMOS process

Shao, Jin; Qiao, Yanbin; Ma, Qiang; Li, Jianqiang; Chen, Yanning; Yuan, Yidong; Tang, Xiaoke; Zhang, Haifeng; Zhao, Dongyan
  • 作者Shao, Jin; Qiao, Yanbin; Ma, Qiang; Li, Jianqiang; Chen, Yanning; Yuan, Yidong; Tang, Xiaoke; Zhang, Haifeng; Zhao, Dongyan
  • 文件大小19250.34KB
  • 发表时间2017
  • DOI10.1109/ICEPT.2017.8046409
  • 页码69-71
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