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[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Modeling and fabrication of the redistribution layer on the 2.5D Si interposer

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Modeling and fabrication of the redistribution layer on the 2.5D Si interposer

Sun, Yunna; Jin, Zhiyu; Luo, Jiangbo; Li, Jian; Sun, Yating; Wang, Yan; Ding, Guifu
  • 作者Sun, Yunna; Jin, Zhiyu; Luo, Jiangbo; Li, Jian; Sun, Yating; Wang, Yan; Ding, Guifu
  • 文件大小31832.36KB
  • 发表时间2017
  • DOI10.1109/ICEPT.2017.8046428
  • 页码157-161
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