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Study on the mechanism of Si–glass–Si two step anodic bonding process

Study on the mechanism of Si–glass–Si two step anodic bonding process

Hu, Lifang; Wang, Hao; Xue, Yongzhi; Shi, Fangrong; Chen, Shaoping

期刊名称Journal of Micromechanics and Microengineering
作者Hu, Lifang; Wang, Hao; Xue, Yongzhi; Shi, Fangrong; Chen, Shaoping
卷第28卷
期第4期
印刷ISSN0960-1317
电子ISSN1361-6439
文件大小1100.04KB
发表时间2018-04-01
DOI10.1088/1361-6439/aaa878

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