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Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

Microstructural Evolution and Mechanical Behavior of High Temperature Solders: Effects of High Temperature Aging

Hasnine, M.; Tolla, B.; Vahora, N.
  • 期刊名称Journal of Electronic Materials
  • 作者Hasnine, M.; Tolla, B.; Vahora, N.
  • 卷第47卷
  • 期第4期
  • 印刷ISSN0361-5235
  • 电子ISSN1543-186X
  • 文件大小6848.78KB
  • 发表时间2018-4
  • DOI10.1007/s11664-017-6042-3
  • 页码2488-2498
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