发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

Knowledge based qualification process to evaluate vibration induced failures in Electronic Components

Meyyappan, Karumbu; Vujosevic, Milena; Wu, Qifeng; Malatkar, Pramod; Hill, Charles; Parrott, Ryan

期刊名称Journal of Electronic Packaging
作者Meyyappan, Karumbu; Vujosevic, Milena; Wu, Qifeng; Malatkar, Pramod; Hill, Charles; Parrott, Ryan
印刷ISSN1043-7398
文件大小2520.56KB
发表时间2018-02-14
DOI10.1115/1.4039301