Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters
- 期刊名称IEEE Transactions on Industrial Electronics
- 作者Zhang, Yi; Wang, Huai; Wang, Zhongxu; Yang, Yongheng; Blaabjerg, Frede
- 印刷ISSN0278-0046
- 电子ISSN1557-9948
- 文件大小13236.19KB
- 发表时间2018
- DOI10.1109/TIE.2018.2823664
- 页码1-1
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