[IEEE 2018 German Microwave Conference (GeMiC) - Freiburg, Germany (2018.3.12-2018.3.14)] 2018 11th German Microwave Conference (GeMiC) - Substituting bond wires by additively manufactured interconnections

• 作者Lomakin, K.; Sippel, M.; Gold, G.; Ringel, J.; Weis, D.; Helmreich, K.; Ankenbrand, M.; Franke, J.
• 文件大小815.66KB
• 发表时间2018
• DOI10.23919/GEMIC.2018.8335106
• 页码367-370