A Low Overhead Solution to Resilient Assembly Lines Built From Legacy Controllers

• 期刊名称IEEE Embedded Systems Letters
• 作者Cronin, Patrick; Hosseini, Fateme S.; Yang, Chengmo
• 印刷ISSN1943-0663
• 电子ISSN1943-0671
• 文件大小659.75KB
• 发表时间2018
• DOI10.1109/LES.2018.2829768
• 页码1-1