Investigation and modeling of binder removal process in nano/micro bimodal powder injection molding
- 期刊名称The International Journal of Advanced Manufacturing Technology
- 作者Oh, Joo Won; Lee, Won Sik; Park, Seong Jin
- 印刷ISSN0268-3768
- 电子ISSN1433-3015
- 文件大小2150.79KB
- 发表时间2018-6-7
- DOI10.1007/s00170-018-2263-8
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