[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - A modular reconfigurable digital microfluidics platform
- 作者Tanev, Georgi; Svendsen, Winnie; Madsen, Jan
- 文件大小3956.63KB
- 发表时间2018
- DOI10.1109/DTIP.2018.8394194
- 页码1-6
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