The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems
- 期刊名称Journal of Low Power Electronics and Applications
- 作者Ganguly, Amlan; Ahmed, M.; Singh Narde, Rounak; Vashist, Abhishek; Shamim, Md; Mansoor, Naseef; Shinde, Tanmay; Subramaniam, Suryanarayanan; Saxena, Sagar; Venkataraman, Jayanti; Indovina, Mark
- 卷第8卷
- 期第1期
- 电子ISSN2079-9268
- 文件大小6613.62KB
- 发表时间2018-02-28
- DOI10.3390/jlpea8010005
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