Stencil Printing Process Optimization to Control Solder Paste Volume Transfer Efficiency
Khader, Nourma; Yoon, Sang Won
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Khader, Nourma; Yoon, Sang Won
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小1789.65KB
- 发表时间2018
- DOI10.1109/TCPMT.2018.2830391
- 页码1-9