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$Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor$

Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor

Auersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S.

期刊名称Microelectronics Reliability
作者Auersperg, J.; Auerswald, E.; Collet, C.; Dean, Th.; Vogel, D.; Winkler, Th.; Rzepka, S.
卷第87卷
印刷ISSN0026-2714
文件大小2597.27KB
发表时间2018-08
DOI10.1016/j.microrel.2018.06.019
页码238-244

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