[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Non-Destructive Fault Localization in Fan Out Wafer Level Packages Using Electro Optical Terahertz Pulse Reflectometry
Rho, Kyungsoo; Lee, Jongmin; Kim, Daejin; White, Thomas; Alton, Jesse
- 作者Rho, Kyungsoo; Lee, Jongmin; Kim, Daejin; White, Thomas; Alton, Jesse
- 文件大小1529.32KB
- 发表时间2018
- DOI10.1109/ipfa.2018.8452600
- 页码1-4