Effect of particle size distribution on the mechanical and electrical properties of reverse-offset printed Sn–Ag–Cu solder bumps
- 期刊名称Journal of Materials Science: Materials in Electronics
- 作者Son, Min-Jung; Jeong, Jae Won; Kim, Hyunchang; Lee, Taik-Min; Lee, Hoo-Jeong; Kim, Inyoung
- 印刷ISSN0957-4522
- 电子ISSN1573-482X
- 文件大小5566.01KB
- 发表时间2018-10-8
- DOI10.1007/s10854-018-0021-1
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