[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Influence of aging temperature and time on the intermetallic reaction in 15μm Cu/Sn copper pillar bump

• 作者Ye, Lei; Huang, Chao; Ling, Huiqin; Hu, Anmin; Li, Ming
• 文件大小10168.16KB
• 发表时间2018
• DOI10.1109/ICEPT.2018.8480735
• 页码462-465