[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Different Material Systems on Interconnection Properties of 30μm Pitch Micro Bumps
Dai, Fengwei; Zhang, David Wei; Zhang, Wenqi; Wang, Guojun; Yang, Dengfeng; Chen, Lin; Cao, Liqiang
- 作者Dai, Fengwei; Zhang, David Wei; Zhang, Wenqi; Wang, Guojun; Yang, Dengfeng; Chen, Lin; Cao, Liqiang
- 文件大小4541.30KB
- 发表时间2018
- DOI10.1109/ICEPT.2018.8480482
- 页码828-831