[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage
- 作者Lall, Pradeep; Yadav, Vikas; Suhling, Jeff; Locker, David
- 文件大小2302.04KB
- 发表时间2018
- DOI10.1115/IPACK2018-8357
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