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[IEEE 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) - Shanghai (2018.11.24-2018.11.26)] 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) - Modeling of Monolithic Spiral Inductors with Patterned Ground Shield for Si-Based RF IC's

[IEEE 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) - Shanghai (2018.11.24-2018.11.26)] 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM) - Modeling of Monolithic Spiral Inductors with Patterned Ground Shield for Si-Based RF IC's

Jin, Xiangliang; Sun, Yongfeng; Xiao, Xiao
  • 作者Jin, Xiangliang; Sun, Yongfeng; Xiao, Xiao
  • 文件大小505.94KB
  • 发表时间2018
  • DOI10.1109/ICAM.2018.8596564
  • 页码156-159
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