Guest Editorial for IRSP 2018 Conference
Budiman, Arief Suriadi; Gan, Chee Lip; Pey, Kin-Leong; Sukharev, Valeriy; Thomas, Olivier
- 期刊名称IEEE Transactions on Device and Materials Reliability
- 作者Budiman, Arief Suriadi; Gan, Chee Lip; Pey, Kin-Leong; Sukharev, Valeriy; Thomas, Olivier
- 卷第18卷
- 期第4期
- 印刷ISSN1530-4388
- 电子ISSN1558-2574
- 文件大小267.05KB
- 发表时间2018-12
- DOI10.1109/TDMR.2018.2881614
- 页码487-489