Thermal, mechanical, and dielectric properties of aluminium oxide and solid glass microsphere-reinforced epoxy composite for electronic packaging application
- 期刊名称Polymer Composites
- 作者Agrawal, Alok; Satapathy, Alok
- 印刷ISSN0272-8397
- 文件大小658.43KB
- 发表时间2019-01-04
- DOI10.1002/pc.25050
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