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The extraction of total cross section fromX. Qian; W. Chen; H. Gao; K. Hicks; K. Kramer; J.M. Laget; T. Mibe; S. Stepanyan; D.J. Tedeschi; W. Xu; K.P. Adhikari; M. Amaryan; M. Anghinolfi; H. Baghdasaryan; J. Ball; M. Battaglieri; V. Batourine; I. Bedlinskiy; M. Bellis; A.S. Biselli; C. Bookwalter; D. Branford; W.J. Briscoe; W.K. Brooks; V.D. Burkert; S.L. Careccia; D.S. Carman; P.L. Cole; P. Collins; V. Crede; A. D'Angelo; A. Daniel; N. Dashyan; R. De Vita; E. De Sanctis; A. Deur; B. Dey; S. Dhamija; R. Dickson; C. Djalali; G.E. Dodge; D. Doughty; R. Dupre; P. Eugenio; G. Fedotov; S. Fegan; R. Fersch; A. Fradi; M.Y. Gabrielyan; G.P. Gilfoyle; K.L. Giovanetti; F.X. Girod; J.T. Goetz; W. Gohn; E. Golovatch; R.W. Gothe; K.A. Griffioen; M. Guidal; L. Guo; K. Hafidi; H. Hakobyan; C. Hanretty; N. Hassall; D. Heddle; M. Holtrop; C.E. Hyde; Y. Ilieva; D.G. Ireland; B.S. Ishkhanov; E.L. Isupov; S.S. Jawalkar; J.R. Johnstone; K. Joo; D. Keller; M. Khandaker; P. Khetarpal; W. Kim; A. Klein; F.J. Klein; V. Kubarovsky; S.V. Kuleshov; V. Kuznetsov; K. Livingston; H.Y. Lu; D. Martinez; M. Mayer; M.E. McCracken; B. McKinnon; C.A. Meyer; T. Mineeva; M. Mirazita; V. Mokeev; K. Moriya; B. Morrison; E. Munevar; P. Nadel-Turonski; R. Nasseripour; C.S. Nepali; S. Niccolai; G. Niculescu; I. Niculescu; M.R. Niroula; M. Osipenko; A.I. Ostrovidov; K. Park; S. Park; E. Pasyuk; S. Anefalos Pereira; S. Pisano; O. Pogorelko; S. Pozdniakov; J.W. Price; S. Procureur; D. Protopopescu; B.A. Raue; G. Ricco; M. Ripani; B.G. Ritchie; G. Rosner; P. Rossi; F. Sabatié; M.S. Saini; C. Salgado; D. Schott; R.A. Schumacher; H. Seraydaryan; Y.G. Sharabian; E.S. Smith; D.I. Sober; D. Sokhan; I.I. Strakovsky; S. Strauch; M. Taiuti; S. Tkachenko; M. Ungaro; M.F. Vineyard; D.P. Watts; L.B. Weinstein; D.P. Weygand; M. Williams; E. Wolin; M.H. Wood; L. Zana; J. Zhang; B. Zhao; Z.W. Zhao · 2009

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Voiding Mechanisms in SMTHance, W.B.; Lee, N.C. · Soldering & Surface Mount Technology · 1993

Assembly with Conductive AdhesivesGilleo, K. · Soldering & Surface Mount Technology · 1995

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SMART group newsSoldering & Surface Mount Technology · 1989