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Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Wang, Shaobin; Yao, Yao; Long, Xu
  • 期刊名称Applied Sciences
  • 作者Wang, Shaobin; Yao, Yao; Long, Xu
  • 卷第9卷
  • 期第2期
  • 电子ISSN2076-3417
  • 文件大小4151.35KB
  • 发表时间2019-01-10
  • DOI10.3390/app9020227
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