Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
Wang, Shaobin; Yao, Yao; Long, Xu
- 期刊名称Applied Sciences
- 作者Wang, Shaobin; Yao, Yao; Long, Xu
- 卷第9卷
- 期第2期
- 电子ISSN2076-3417
- 文件大小4151.35KB
- 发表时间2019-01-10
- DOI10.3390/app9020227